Products

UX-48MM  INSPECTION  MODULE

The UltraVim UX-48MM inspection module uses two 2330x1750 cameras to inspect QFP and TSOP devices up to 32mm (terminal dimension) and BGA packages up to 46mm in three dimensions. Standard device file libraries provide for easy setup and training. Software menus can be changed to Chinese or Japanese. Ethernet, Digital I/O and serial communications are supported.

VX-48MM  INSPECTION  MODULE

The UltraVim VX-48MM module can inspect a variety of leaded device packages including QFP, TSOP and J-Lead devices in three dimensions. Standard device file libraries provide for easy setup and training. Custom optics automatically compensate for changes in device height to provide true metrology data.

4D-35MM  INSPECTION  MODULE

The UltraVim 4D module can inspect a variety of leaded device packages including QFP, TSOP and SOIC packages in three dimensions. Standard device file libraries provide for easy setup and training. The standstill time is less than 20 milliseconds and there is no need to plunge the device.

2D-30MM  INSPECTION  SYSTEM

The UltraVim 2D-30MM system uses a 1280x1024 USB camera to provide mark and other 2D inspections. The software can be used as a separate system or with the UX, VX and 4D inspection modules to provide additional inspections.

UP-48MM  UPGRADE

If you already own a complete UltraVim UP module that was manufactured 2001 or later, we can upgrade the system with a new motherboard, processor, operating system and 2330x1750 cameras.

UV-48MM  UPGRADE

We provide upgrades for complete UltraVim UV modules that have been manufactured 2001 or later. The upgrade includes a new motherboard, processor, hard disk, operating system and 2330x1750 camera.

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